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C101 Grade High Flexibility Thin Copper Foil For Thinner Smart Phone EMI / EMC

Categories RA Copper Foil
Brand Name: Civen
Model Number: MGP-TR021012
Certification: CTI/ SGS /PPAP /TS
Place of Origin: Shanghai , China
MOQ: 1000kg
Price: USD 5.0 - 48.0 Per Kilogram
Payment Terms: L/C, T/T
Supply Ability: 550000 KG / Month
Delivery Time: 10 - 15 Days
Packaging Details: Wooden Box For Exporting
Material: South America Imported Copper Ingot
Purity: Cu + Ag ≥ 99.99%, Extra Pure
Color: Gray Matte Side
Application: EMI EMC in Smart Phone or Display Screen
Width: ≤ 600 mm ( About 24 inch )
Type: RA Copper Foil, not ED foil
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    C101 Grade High Flexibility Thin Copper Foil For Thinner Smart Phone EMI / EMC

    C101 Grade High Flexibility Copper Foil For Thinner Smart Phone EMI / EMC


    Produict Information :

    1. Civen RA Copper Foil is rolled from pure copper ingots, the process including purifying copper ores, make into copper cathodes, ingoting, rolling, annealing, washing, testing, slitting and packing. Our copper ores are imported from South America, which were famous for their copper mining.
    2. 110-anneal (Electrolytic Tough Pitch or ETP) dead soft. Min 99.99% CU.

    Ordinary Suuplied Size :


    (1) Thickness: 12um / 18um / 35um

    (2) Width: 260mm / 520mm and so on .


    Performances:


    (1) High flexibility and extensibility

    (2) Even and smooth surface

    (3) Good fatigue resistance

    (4) Strong antioxidant properties

    (5) Good mechanical properties

    (6) The material has higher extensibility

    (7) It has a high bending resistance

    (8) It has no crack.


    Note:

    We can provide products with other properties according to customers` requirements.


    Technical Data Sheet :


    Item

    Unit

    Parameters

    12μm

    18μm

    25μm

    35μm

    70μm

    Mass per unit(±5%)

    g/m²

    105

    160

    300

    400

    445

    Cu+Ag

    %

    ≥99.99

    Temper


    H

    O,H

    O,H

    O,H

    O,H

    Surface roughness

    Ra

    μm

    0.13

    0.12

    0.1

    0.08

    0.08

    Rz

    μm

    1.3

    1.0

    0.8

    0.74

    0.76

    Tensile strength

    Normal Temp /23℃

    N/mm²

    ≥430

    ≥450

    ≥450

    ≥450

    ≥450

    High Temp /220℃

    N/mm²

    ≥140

    ≥150

    ≥170

    ≥210

    ≥220

    Elongation

    Normal Temp /23℃

    %

    ≥1.5

    ≥3.0

    ≥4.0

    ≥4.2

    ≥4.5

    High Temp /220℃

    %

    ≥8

    ≥10

    ≥18

    ≥28

    ≥30

    Fatigue Resistance (annealed)

    %

    65

    65

    65

    65

    65

    Maximum resistivity

    Ωmm2/m

    0.0181

    Electrical conductivity

    %

    ≥98.3%

    Film and adhesive layers

    Instant Temp.

    300℃/10s

    Film and adhesive paste after transient

    temperature without blistering delamination.

    Anti oxidation

    H.T.(200℃)

    Minute

    Won’t Change the Color within 60 minutes

    Pinhole test results

    piece/ m²

    Pinhole area more than 0.5 mm²,0.005 piece/ m²


    Note:

    1. Above figures based on the material with 0.05mm in thickness and 600mm in width.

    2. Normally, Copper, cobalt and nickel is coated on the rough surface.

    3. Testing method follows our company standard.


    Application and Performance :


    Packing Condition :


    Product Tags:

    pure copper foil

      

    rolled copper foil

      
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